Although LED lights save energy and provide high brightness, the chip size of a single LED is very small, only 1mm square, the size of a grain of millet, and the power is only about 1W. In order for the LED chip to achieve 500W or even 1000W super power, we need to package it. At present, the packaging structure of high-power lighting mainly includes SMD and COB.

SMD is an independent packaging method for a single LED chip, and then multiple SMD lamp beads are integrated into the PCB to form a high-power LED module. Its advantage is that the shape of PCB can be designed according to the appearance of lamps and the required power can be combined according to the requirements.
However, there is a disadvantage to this approach, which is that each bead is a luminous point, and multiple points of illumination produce double shadows. Moreover, there is a considerable space between the beads, which makes the volume and weight of the lights very large if the stadiums use SMD integrated high-power LED lights. NO,NO,NO, let's go for a bigger field.

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