AlN substrate has the problem of high refractive index and very low optical extraction efficiency, so it is necessary to improve the chip optical extraction efficiency. Therefore, it is proposed that AlN substrate surface forms two-dimensional light with basically the same size and wavelength

The sub-crystal structure, with a light extraction efficiency of 140 percent of what it would have been without such a surface finish, is combined with a pattern of nanostructures smaller in size than the wavelength. The efficiency of light extraction is 196% of that without such surface processing.

3.2 Heat-resistant and ULTRAVIOLET packaging
Because the energy of the deep ultraviolet photon is very high, if the packaging method of white light is adopted, the optical resin is used to package it. Under the condition of high energy ultraviolet irradiation for a long time, the optical resin is easy to turn yellow

The life of UVC LED is greatly shortened.
Metal glass airtight package glass ceramic airtight package glass ceramic bond package glass ceramic bond package

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