On the way to break through the bottleneck technology of Micro LED, researchers worldwide never stop.
Please note that the research team of Guangdong Semiconductor Industry Technology Research Institute, Tokyo University and Foshan Debao Display Technology Co., Ltd. conducted a study on "Wafer-Scale Micro-Leds Transferred to an Planar and Flexible Displays".

The study, recently published in the journal Advanced Materials Technologies, demonstrates a new transfer technique that combines a tape and laser stripping process.
In this study, the researchers describe a system solution called Tape-Assisted Laser Transfer (TALT), which USES a low-cost tape as a supporting substrate, USES a laser stripping process to transfer Micro leds onto the tape, and then places another piece of tape. Because of the strong adhesive force of the tape, Micro LED can transfer from the first piece of tape to another piece of tape for flip joint.

According to the researchers, this method can realize rapid transfer of wafer-level Micro LED, with high yield and maximum displacement reduction. At the same time, the Micro LED can be selectively transferred to the tape through the laser stripping process.
The researchers say the technology is suitable not only for wafer level Micro LED transfer but also for flip joint. They believe this technology has great potential in developing curved or flat Micro LED display panels for AR/VR smart glasses.

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